Applications of Finite Element Methods for Reliability by Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou PDF

By Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou

ISBN-10: 0857293095

ISBN-13: 9780857293091

Applications of Finite aspect equipment for Reliability reports on ULSI Interconnections offers an in depth description of the appliance of finite point equipment (FEMs) to the examine of ULSI interconnect reliability. during the last 20 years the applying of FEMs has develop into common and maintains to steer to a higher knowing of reliability physics.

To aid readers do something about the expanding sophistication of FEMs’ functions to interconnect reliability, Applications of Finite aspect tools for Reliability reports on ULSI Interconnections will:

  • introduce the primary of FEMs;
  • review numerical modeling of ULSI interconnect reliability;
  • describe the actual mechanism of ULSI interconnect reliability encountered within the electronics undefined; and
  • discuss intimately using FEMs to appreciate and enhance ULSI interconnect reliability from either the actual and functional standpoint, incorporating the Monte Carlo method.

A full-scale overview of the numerical modeling method utilized in the learn of interconnect reliability highlights worthwhile and remarkable strategies which were constructed lately. Many illustrations are used during the publication to enhance the reader’s knowing of the technique and its verification. real experimental effects and micrographs on ULSI interconnects also are included.

Applications of Finite point tools for Reliability experiences on ULSI Interconnections is an effective reference for researchers who're engaged on interconnect reliability modeling, in addition to if you need to know extra approximately FEMs for reliability purposes. It offers readers a radical knowing of the functions of FEM to reliability modeling and an appreciation of the strengths and weaknesses of varied numerical versions for interconnect reliability.

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Extra resources for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Example text

Their derivation was based on the assumption that the change in the plastic strain leads to an increase of the void volume which is proportional to the increase of the line resistance. With this assumption, they derived the median time to failure (MTF) for SIV as follows   T EA tlife / C ð2:43Þ exp kT T0 À T where C is independent on temperature and represents a specific constant for a set of identical test structures. The temperature exponents in Eqs. 43 are different, and different temperature exponent can lead to a deviation of the estimated activation energy.

In this case, Eq. 38 is identical to the usual diffusion equation with K acts as the diffusivity. 2 Review on the Modeling of SIV 29 This effective bulk modulus B is dependent on the cross section of the interconnect as well as dielectric materials, and one can therefore inferred from Eq. 40 that a structure with a smaller B will lead to a longer SIV lifetime, if other things being the same. Fischer et al. proposed another model to formulate the SIV lifetime [47, 74]. Their derivation was based on the assumption that the change in the plastic strain leads to an increase of the void volume which is proportional to the increase of the line resistance.

An example is a very important physical principle to describe a deformation process of an elastic body, namely the Principle of Minimum Total Potential Energy, which can be summarized as follows. The total potential energy of an elastic body is given in E ¼ X þ Y : Total Potential Energy ð3:12Þ where X is strain energy, and Y is potential energy, they are from external loads. E is the minimum with respect to the state variables or function variables at equilibrium state. As the total potential energy is a function of state variables or a function of functions, which is called ‘‘functional,’’ the next task is to find the minimum through PDE given as oE ¼ 0; oui i ¼ 1; .

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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections by Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou


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